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“EcoMEP” Electroplated Wire : for slicing silicon ingots
Electroplated diamond wire, EcoMEP, is a small-diameter, high-strength wire that has been electroplated with diamond grains using a special technique. It can be used to cut multiple slices of hard brittle materials such as silicon, sapphire, and neodymium-iron alloy, enabling the rapid production of a number of wafers at the same time. It has also been proven in applications that involve cutting rare metals and materials that are difficult to machine, with uses that include single cutting and sizing as well as cutting multiple slices. The use of water-soluble cutting fluid during cutting allows for the collection and recovery of shavings, making EcoMEP a product that is easy on the global environment while also reducing total costs. Asahi Diamond Industrial also has its own test cutting apparatus that can be used to provide customers with optimal cutting conditions and settings to suit their specific materials.
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Slicing silicon, sapphire, Neodymium iron and hard brittle materials
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Cutting difficult-to-machine materials and rare materials
“SOLOTERU” Metal Grinding Wheel with Uniform Distribution of Abrasive Grains
The use of a technique for ensuring an even distribution of abrasive grains within the abrasive layer delivers improved cutting performance together with long life compared to the metal tools traditionally used for machining precision components and mechanical parts made from ceramics and similar materials. The superiority to other tools also includes enhanced cutting performance when machining hard brittle materials and other special materials thanks to the ultra-thin cutting edge of the abrasive layer, with benefits that include minimizing the cutting load and reducing chipping.
Electroplated Diamond Band Saws
Thin-band saws (consisting of an endless, high-strength steel band with an electroplated diamond cutting edge) is capable of cutting large-diameter silicon ingots and other large diameter materials accurately and efficiently and can be manufactured in different sizes.
OD Blades : for MONO & MULTI crystalline silicon ingot bricks
OD Blades : for MONO & MULTI crystalline silicon ingot bricks
Diamond Wheels (Peripheral Grinding / Orientation Flat Processing)
Metal bond wheels are used for the peripheral grinding of silicon ingots, or processing orientation flats to show the crystal orientation and processing notches. Based on our past experience in various fields, we provide wheels that fulfill the needs of our clients and fit the machines they are using.
ID Blades Slicing Silicon Ingots
ID blades are used to slice silicon ingots and other semiconductive materials with a high degree of accuracy. ID blades have been developed to accommodate increasingly larger wafer sizes and are also used to slice glass, ceramics, and other hard materials.
“SUNCREA” High Efficiency Metal Bond for Difficult-to-machine Materials
SUNCREA realizes sharpness and service life which could not be obtained with conventional metal bonds in sapphire, carbide, hard brittle materials such as ceramics and ferrite, hard magnetic materials such as neodymium iron, iron-based materials such as sintered parts, contributing to processing efficiency improvement and cost reduction.
Core Drills : for sapphire
Used for coring sapphire for LED substrates
Diamond Wheels (Edge Grinding & Notch Grinding : for silicon wafers)
Metal bond diamond wheels are used for edge grinding of silicon wafers. For notch grinding of large-diameter wafers, a small-diameter formed wheel is employed.
Diamond Wheel for Surface Grinding of Various Wafers
This diamond wheel is for surface grinding various wafers such as those for semiconductor materials and electronic devices. We supply the optimum diamond wheel for each material. It helps minimize processing damage, improve processing efficiency and reduce processing cost, and is customizable according to customer needs.
Notch Grinding Wheels
Small-diameter formed wheels are used to finish the notches of Large-diameter wafers. Our notch grinding wheels maintain the run out accuracy of diamonds to the shank, and prduce a favorable wafer circumference, As with our edge grinding wheels, we are able to provide a wide variety of specifications, including single-grooved wheels, multi-grooved wheels, and wheels for both rough and finish grinding.
Diamond Wheels : for edging thin sheet glass
Metal bond diamond wheels are also used in the chamfering of thin sheet glass, such as the screens used in televisions, clocks, and personal computers.
Diamond Wheels : for magnetic materials
​The tooling requirements of advanced processes, such as internal grinding, cylindrical grinding, centerless grinding, double-disc surface grinding, thread-grinding and cutting of ferrites, samarium cobalt, neodymium iron and other magnetic materials, vary widely. Asahi Diamond’s overall technological capabilities, and its expertise in bond selection in particular, has enabled it to keep pace with the quickly evolving needs of its customers.
1.Diamond wheels for centerless grinding (metal and resin bond wheels for grinding magnetic materials)
2.Metal bond diamond wheels for double-disc surface grinding
3.Metal bond diamond wheels for grinding rotary transformer cores
4.Electroplated formed diamond wheels for grinding magnetic and ceramic materials
Diamond Wheels : for precision grinding of optical Glass
Diamond wheels with varying bonding materials such as curve generating wheels, pellets, lens centering wheels and chamfering wheels are used for grinding camera and binocular lenses, prisms and recently glass board for hard disks, etc.
“SUN NOVEL” High Elastic Metal Bond Cutting Wheels
SUNNOVEL inherited double features. Long tool life from metal bond, better cutting from resin bond.
Great improvement in chipping and cutting accuracy compared with the other cutters.
ASPIRE POLYX wheels have achieved higher sharpness and longer service lives than conventional resin and polyx bonds for processing crustaceous materials such as carbide, ceramics, glass, and iron materials. Their flexible grinding cover grinding performances of metal or vitrified bonds and improve processing efficiency with reduced costs.
AERO METAL provides significantly improved cutability compared to past metal bonds due to its porous structure (with open pores) that uses a metallic bonding material, providing easier circulation of grinding fluid and being less prone to shedding chips. It can satisfy a wide range of requirements, from ease of cutting to long life, with the chemical bond between the bond and abrasive grains helping retain these grains.
The electroplated wheels feature high precision, high efficiency, long service life and stable sharpness. The CERAMATE drill is specialized for the center-through type, featuring high cooling effects, an epoch-making processing speed and long service life. The CERAMATE end mill is a general-purpose, collet-through-type grooving tool specialized for ceramics. The CERAMATE tap is a collet-through-type threading tool that can perform JIS2 M3-M12 threading and has halved the number of threads to reduce tool load. The CERAMATE contouring is a collet-through-type contouring tool that can perform a high-speed feeding process.
The product is used for processing magnetic materials when sharpness is required. With circuit surface concavity and convexity set up in a screw shape, the product can be applied toφ100 and smaller wheels and complex-shape wheels.
Super abrasive resin wheel to expand standard working area. The feature of the bond is highly elastic & a special structure. Hard type BRS2, has hardness and toughness to grip abrasive grain. Flexible type BRS5, is porous and soft. And both of them uses elastic resin.
Dies can be supplied to suit a wide variety of user performance requirements, with a product range that extends from 0.008mm to 30mm and can cope with different materials and physical properties, from flexible wires such as gold wires used by the semiconductor industry to rigid wires such as steel cord.
The dies have earned a strong reputation, especially for their ability to satisfy the tight size tolerances required for ultra-thin wire and the high quality of internal surface finish in large diameters. Wire drawing dies, shaped dies, tin-coating guide dies, and single- or multi-core nipples are available in a choice of different materials to suit different applications and requirements.
The special paste and diluting fluid can sustain high performance over a long time even in a small volume. The SP-WO allows economic lapping and polishing processes to be conducted for every material type when diluting fluid is used appropriately. Slurry that excels in uniform dispersibility, lubricity and cooling effects allows you to take maximum advantage of diamonds’ excellent capabilities to achieve high-precision finished surfaces.
Chemical mechanical polishing (CMP) helps smooth wafer surfaces, an important part of VLSI production. Conditioning is essential to assure stable CMP grinding. Asahi Diamond offers a variety of CMP conditioners to suit diverse wafer shapes and specifications.
This diamond wheel is for surface grinding various wafers such as those for semiconductor materials and electronic devices. We supply the optimum diamond wheel for each material. It helps minimize processing damage, improve processing efficiency and reduce processing cost, and is customizable according to customer needs.
Hub-type electroformed blades are used for dicing patterned wafers. Because they have aluminum alloy hubs, they can be used more easily than ring-type blades. Not only can the specifications for our dicing blades be set according to the client’s needs, but the blades can also handle materials that are difficult to find, such as wafers with metallic film, by using specially-treated blade edges.
Hubless-type blades are suitable for various cutting grooving applications, such as silicon wafers, compound semiconductor wafers, etc. Nickel plating is the bonding material and with the proper diamond size, blades as thin as 15μm are available. The various specifications available make it possible to choose the best blade for your requirements.
The SUNMIGHTY blades have a high tensile strength stainless steel core with nickel bonded diamonds on the outside edge, The recess between the core and abrasive layer help to improve coolant flow and easy removal of the particles generated during dicing. This achieves reduced blade wear to the side of the cutting edge.
With high-precision processing technologies using monocrystal diamond, we have produced sharp cutting edges and nano-order contour accuracy also in the ultra-precise cutting market. They are used, for example, for mirror finishing of various lens products and lens molds and nonferrous metal products.
SUNBRIGHT is a monocrystal diamond cutting tool that offers ultra-precision cutting performance.
We have produced a sharp cutting edge and achieved nano-order contour accuracy using high-precision processing technology.
It can be used for mirror finishing various lens products, lens molds and non-ferrous metal products.
To work on precision electronic parts, a thin cutting wheel is required. Asahi Diamond’s non-core type wheels are hubless and highly precise. The wheels are commonly used with dicing machines or high precision slicing machines. Various types of bonds (metal, resin) are available for this type of cutting wheel which is also used to cut resin, metals, ceramics, glass, compound materials, various electronic parts, and optical parts.
The TCR is a metal bond cutting wheel with a rigidity that is even equal to electroformed cutting wheels.
This is a new metal bond that offers the service life of a metal bond and the sharpness of a resin bond.
It is used to obtain the same level of abrasion resistance as metal in difficult-to-machine materials and materials requiring high processing quality.
Single type cutting wheels have a steel core with a diamond or CBN abrasive grain on the outer rim. Available with various selections of grains (diamond or CBN), bond (metal, resin, electroplated), cutting edge shape (V, R-shape) and core design (Straight, Under-neck relief, All relief).
This is a flange with multiple cutters attached to improve processing efficiency. Our proprietary technology responds to customers’ high demand for pitch and shape.
The cutter has been developed for cutting electronic materials including glass and ceramics for which chipping and cutting resistance must be suppressed.
The resin and metal bond wheels have been developed for cutting rare-earth magnets featuring sharpness and long service life. The Resin Bond SN100 (for cutting) excels in shape maintenance and can be used without dressing. The total service life has been doubled. Compared with conventional bonds, the new bond can sustain more stable sharpness irrespective of rare-earth magnet types. The metal bond SN10 (for cutting) features a sharpness that is 30% better than conventional metal bonds achieving the same feeding as resin bonds. The bond excels in autogenous operation. The dressing frequency has been reduced to improve workability and maintain processing accuracy and achieving long service life.
​As a tool attached to the tail stock of a lathe or a cylindrical grinding machine to support a workpiece, lathe centers play an important role in maintaining the accuracy of processed products. Replacing this part, which is subjected to friction, with SUNPAX improves efficiency and reduces running costs. We cater to various requirements including convex, concave and standard taper specifications as well as special specifications.
Using SUNPAX to extend the service life of presser jigs and stabilize accuracy during bearing grinding, helps improve productivity. Products on offer include rest shoes, backing plates, pressure rotors, front plates, front shoes, rear shoes and contacts.
Diamond scribers are used for scribing silicon wafers into pellets and are available in different configurations including cone-shaped, multi-point and shell-shaped. Each is specifically adapted to various work requirements. Multi-point scribers rotate to make use of a new tip after wear, offering longer tool life.